2007年4月17日新聞－上海華虹NEC電子有限公司（下稱華虹NEC）和賽普拉斯半導(dǎo)體有限公司（NYSE: CY）已簽署了一項(xiàng)協(xié)議：賽普拉斯允許華虹NEC使用其0.13 um SONOS記憶元件內(nèi)嵌的非揮發(fā)性內(nèi)存（NVM）技術(shù)。 華虹NEC小生境技術(shù)平臺(tái)的戰(zhàn)略之一就是內(nèi)嵌的非揮發(fā)性內(nèi)存。其0.35 um內(nèi)嵌的電可擦除只讀存儲(chǔ)器，0.35內(nèi)嵌的OTP和0.25um內(nèi)嵌式閃存技術(shù)在幾年里形成了大批量生產(chǎn)。也使華虹NEC在內(nèi)嵌NVM領(lǐng)域取得了顯著成效。賽普拉斯0.13um SONOS技術(shù)將會(huì)延伸華虹NEC豐富的技術(shù)，在賽普拉斯授權(quán)之后，還將加強(qiáng)華虹在內(nèi)嵌的NVM市場(chǎng)的領(lǐng)導(dǎo)地位。 SONOS閃存擁有許多優(yōu)勢(shì)，如極好的銷路、高持久性、低動(dòng)力支持、輻射硬度和擁有標(biāo)準(zhǔn)CMOS技術(shù)的高壓縮性。此外，與其它內(nèi)嵌NVM技術(shù)相比，SONOS借助低罩加法器能提供更經(jīng)濟(jì)有效的解決方案。 “我們非常高興能與賽普拉斯就內(nèi)嵌式閃存和EEPROM技術(shù)建立合作關(guān)系。通過借鑒賽普拉斯在SONOS方面的技術(shù)經(jīng)驗(yàn)，華虹NEC可以為自己的客戶提供更廣泛更優(yōu)質(zhì)的鑄造服務(wù)?！比A虹NEC總裁Steve Liu先生說，“0.13umSONOS NVM技術(shù)也會(huì)將華虹NEC在內(nèi)嵌閃存/ EEPROM領(lǐng)域推向領(lǐng)導(dǎo)者地位?！睂?duì)像智能卡和半導(dǎo)體應(yīng)有方面的應(yīng)用這將是一個(gè)強(qiáng)有力的支持。 賽普拉斯wafer fabs 和技術(shù)部執(zhí)行副總裁Shahin Sharifzadeh說：“華虹NEC在內(nèi)嵌閃存/ EEPROM鑄造市場(chǎng)是一個(gè)極好的領(lǐng)導(dǎo)者。這一協(xié)議也將幫助推動(dòng)賽普拉斯SONOS技術(shù)成為多種內(nèi)嵌式NVMY應(yīng)用的卓越解決方案?！? original text [COLOR=#708090]Hua Hong NEC Establishes NVM Technical Cooperation Relationship with Cypress SHANGHAI, China and SAN JOSE, Calif, April 17, 2007 —— Shanghai Hua Hong NEC Electronics Co. Ltd. （"Hua Hong NEC"） and Cypress Semiconductor Corp. （NYSE: CY） have signed an agreement whereby Cypress will license its 0.13um SONOS （Silicon Oxide Nitride Oxide Silicon） embedded nonvolatile memory （NVM） technology to Hua Hong NEC. Embedded nonvolatile memory is one of the strategic niche technology platforms offered by Hua Hong NEC. Its 0.35um embedded EEPROM, 0.35um embedded OTP and 0.25um embedded Flash technologies have been in mass production for several years and have helped Hua Hong NEC to deliver outstanding performance in the area of embedded NVM. Cypress’s 0.13um SONOS technology will extend Hua Hong NEC’s rich technology offering and enhance its market leadership in embedded NVM, while enabling Cypress to drive adoption of the technology. SONOS flash memory has numerous advantages, such as excellent salability, high endurance, low power, radiation hardness, and is highly compatible with standard CMOS technologies. In addition, SONOS can provide more cost-effective solutions with a low mask adder, compared to other embedded NVM technologies. "We are delighted to cooperate with Cypress on embedded flash/EEPROM technology at the 0.13um node. By leveraging Cypress’s experience with SONOS technology, Hua Hong NEC can offer its customers a more comprehensive and higher quality foundry service," said Dr. Steve Liu, president of Hua Hong NEC. "0.13um SONOS NVM technology will also put Hua Hong NEC in a leading position in the area of embedded flash/EEPROM. This will be a powerful technology for applications such as smart cards and microcontrollers." "Hua Hong NEC is a well-established leader in the embedded flash/EEPROM foundry market," said Shahin Sharifzadeh, executive vice president of wafer fabs and technology at Cypress. "This agreement will help to drive Cypress’s SONOS technology as the predominant solution for a variety of embedded NVM applications."[/COLOR]